September 2022
Packaging Optimization Software @ FachPack 2022!
scapos AG will join the FachPack fair in Nürnberg (27. - 29.2022) and show their software products for the packaging optimization in hall 4, booth 4-245:
May 2022
OptoInspect3D Inline at Control 2022,
3. - 6. May, Stuttgart
After almost 3 years we are very happy to be able to invite you to meet us at the CONTROL 2022 trade fair, taking place in Stuttgart from May 3rd to 6th. We will be presenting the latest version of OptoInspect3D Inline, the software library for the analysis of 3D metrology data.
We look forward to meeting you next week at our booth in the Fraunhofer special show on “Contactless Measuring Technology” (Hall 6, booth 6401).
March 2020
Software for the optimization of pallets PUZZLE® at LogiMAT 2020!
scapos AG will join the LogiMAT fair in Stuttgart (10. - 12.03.2020) and show their software products for the packaging optimization in hall 1, booth K61:
PUZZLE® – Software for the optimization of pallets now with REST API for WMS Systems
PUZZLE® has been optimizing the space of boxes and pallets since 1992. Numerous companies have already used licensed versions of the software, developed by the Fraunhofer Institute for Material Flow and Logistics, and benefited from the more efficient allocation of shipping space. PUZZLE® not only calculates the most optimal arrangement of geometric objects in a defined space but it also helps the user select the right loading equipment for the job.
May 2019
OptoInspect3D Inline at Control 2019,
7. - 10. May, Stuttgart
In collaboration with Fraunhofer IFF scapos will present the new software library 
OptoInspect3D Inline at the Control 2019 trade-fair in Stuttgart, from May 7th to 10th. You can find us at the Fraunhofer Alliance “Vision” booth (Hall 6, booth 6301).
We are looking forward to meeting you at booth 6/6301.
April 2019
MESHFREE at the Automotive CAE Grand Challenge 2019
The new product MESHFREE, an innovative simulation tool for fluid and continuum mechanics, will be presented at the Automotive CAE Grand Challenge conference taking place in Hanau, Germany from April 16th to 17th.
March 2019
Interview with Guy Lonsdale on FocusCoE appeared in Primeur Magazine
scapos CEO Guy Lonsdale talked to 
Primeur Magazine on the recently launched EU project FocusCoE and the role of the EU HPC CoEs (Centres of Excellence) in the EU HPC strategy.
The full article ("FocusCoE to support HPC Centres of Excellence for outreach to the broader European HPC community") can be found on the Primeur Magazine web site: http://primeurmagazine.com/weekly/AE-PR-04-19-79.html
February 2019
scapos coordinates new EU project FocusCoE
scapos leads the recently started Horizon 2020 project FocusCoE, running from 1.12.2018 until 30.11.2021. This project supports the activities of the EU HPC centres of excellence (CoEs), which develop key applications for the next generation of supercomputers in the Exascale range (one Billion Billion = 1018 operations per second), supporting the goal of the EU to establish a leading and independent European HPC ecosystem in the Exascale era. Applications are an important pillar of that strategy, complementing hardware technology development and deployment of HPC systems.
December 2018
New Release of OptoInspect3D Inline Version 2.6
OptoInspect3D Inline Version 2.6 was released in December and is now available. This new version includes a number of functional and performance improvements and several new features.
Here you will find information about functional and performance improvements and several new features
November 2018
OptoInspect3D Inline at VISION 2018, 06.-08. November!
In collaboration with the Fraunhofer society scapos will present the new software library OptoInspect3D Inline at the VISION trade-fair in Stuttgart, from November 6st to 8th. You can find us at the Fraunhofer booth: Hall 1, booth 1G42
September 2018
Packaging Software PackAssistant and PUZZLE® FachPack 2018!
scapos AG will join the FachPack fair in Nürnberg (25. - 09.2018) and show their software products for the packaging optimization in hall 4, booth 4-239:
PackAssistant: Fast and optimal container load Planning
Making the best use of container space can save both, transportation and storage costs. One simply needs to find the right way to arrange the objects to be packed in the available container space. Experienced packing planners usually spend a lot of time meticulously arranging and packing parts with complex shapes but, nevertheless, they will not, in most cases, achieve the same packing density as realized with PackAssistant.The PackAssistant software calculates the optimal packing arrangement of identical parts in standard containers by using 3D designs (CAD). This also works for parts with complex shapes, as the software will identify and take the individual shape of the object into account.
PUZZLE ®: Software for optimizing loading units and transport units
PUZZLE® has been optimizing the space of boxes and pallets since 1992. Numerous companies have already used licensed versions of the software, developed by the Fraunhofer Institute for Material Flow and Logistics, and benefited from the more efficient allocation of shipping space. PUZZLE® not only calculates the most optimal arrangement of geometric objects in a defined space but it also helps the user select the right loading equipment for the job.
July 2018
New Release of OptoInspect3D Inline Version 2.4
OptoInspect3D Inline Version 2.4 was released in July and is now available. This new version includes a number of functional and performance improvements and several new features. One of the most important new features is the improved numerical stability and accuracy of the Minimum Zone computations using Chebyshev approximation methods.
Here you will find information about functional and performance improvements and several new features
April 2018
OptoInspect3D Inline at Control 2018, 24.-27. April, Stuttgart
In collaboration with Fraunhofer IFF scapos will present the new software library OptoInspect3D Inline at the Control 2018 trade-fair in Stuttgart, from April 24th to 27th. You can find us at the Fraunhofer Alliance “Vision” booth (Hall 6, booth 6302).
Free day passes are available here.
We are looking forward to meeting you at booth 6/6302.
August 2017
Primeur Magazine Interview with Guy Lonsdale
scapos CEO Guy Lonsdale talks to Primeur Magazine about the company and its HPC-related products and on the general context of EU R&D project activities that promote the broader take-up of HPC and prepare the technology for exascale computing platforms.
The article (“European exascale projects seek to make programme environments more application suitable”) is available here http://primeurmagazine.com/weekly/AE-PR-09-17-35.html
May 2017
OptoInspect3D Inline at Control 2017, 9.-12. May, Stuttgart
In collaboration with Fraunhofer IFF scapos will present the new software library OptoInspect3D Inline at the Control 2017 trade-fair in Stuttgart, from May 9th to 12th. You can find us at the Fraunhofer Alliance “Vision” booth (Hall 6, booth 6302). Free day passes are available here.
We are looking forward to meeting you at booth 6/6302.
November 2016
New Product for processing measurement data: OptoInspect3D Inline.
scapos has extended its product portfolio in the area of digital manufacturing and Industry 4.0: the C++ library OptoInspect3D Inline, which is developed by the Fraunhofer Institute IFF in Magdeburg. The software library processes 3D data sets so rapidly, that the inspection of components – for example the comparison with an optimal CAD geometry or the verification of specific geometric characteristics – can be automated and integrated in the manufacturing chain.
Instead of inspecting only some statistical samples, every manufactured part can be examined and validated. The integration of OptoInspect3D Inline into customized process chains is flexible: independent of the digitalization technique used (e.g. structured light 3d scanners, light section or laser scan) the different methods can be combined as needed.
November 2016
ModelCompare – New Product for fast and easy FE Model Comparison
The new CAE tool ModelCompare – developed by Fraunhofer Institute SCAI – provides a fast and easy comparison of different Finite Element models. Currently, the tool is available as an Animator plug-in but can be adapted to other pre- and post-processors. ModelCompare portrays differences regarding discretization, material-ID and thickness, independent of the assigned part ID or the names of the components. It uses specialized mapping techniques that result in extremely short run times.
Fraunhofer SCAI will present the new product, in addition to the latest developments for MpCCI (LINK), at the VDI SIMVEC conference in Baden-Baden on 22nd and 23rd of November, 2016.
Typically, LAMA targets applications with needs in numerical mathematics (such as CFD and FEM simulation). Furthermore, LAMA 2.0 integrates methodology in the areas of optimization (e.g. for seismic imaging), computer vision, and deep learning.
It is available with an industry-friendly dual licensing model (AGPL for open source or individual agreements for other interests).
LAMA 2.0 accelerates more than just numerical applications
Fraunhofer SCAI publishes with LAMA 2.0 the next evolution of its high performance computing framework. It has grown from a linear algebra library to a multi-purpose programming framework.
By offering DSL-like C++-Syntax LAMA encourages writing of hardware-independent code. The framework allows the management of data on heterogeneous and distributed system architectures. These can range from embedded “System on a Chip” (aka SoC) devices to highly-parallel Supercomputers. Consequently, LAMA offers full cluster support. Kernel management is provided with ready-to-use modules encapsulating interfaces to Intel® MKL and Nvidia® cuBLAS/cuSPARSE (targeting all multicore CPUs, Nvidia® GPUs, and Intel® Xeon® Phi™). For the purpose of extending LAMA, the framework supports the integration of custom modules.
Hence, it greatly facilitates the development of fast and scalable software for nearly every system on every scale. LAMA accelerates the time-to-market for new product developments significantly, reduces the time spent in maintaining existing code, and offers up-to-date hardware compatibility for even the latest architectures.
Typically, LAMA targets applications with needs in numerical mathematics (such as CFD and FEM simulation). Furthermore, LAMA 2.0 integrates methodology in the areas of optimization (e.g. for seismic imaging), computer vision, and deep learning.
It is available with an industry-friendly dual licensing model (AGPL for open source or individual agreements for other interests).
Meet us at Eurotox fair in Sevilla!
From 4. - 7. September 2016 scapos will join the Eurotox fair in Sevilla and show its new product in the area of In-Vitro Technologies – the ExpoCube!
June 2016
Meet us at ISC 2016!
scapos AG will continue its presence at the ISC series as co-exhibitor at the ISC 2016 conference and exhibit in Frankfurt (June 19 – June 23, 2016). We will present HPC-related software products and introduce HPC- Cloud R&D funding opportunities, targeting engineering & manufacturing SMEs, arising in the EU H2020 Project Fortissimo 2.
Meet us at booth 818!
November 2015
HPCwire awards for Fortissimo
We were immensely pleased to receive two HPCwire awards at the recent SC'15 event in Austin, Texas. Fortissimo was given both the Editors' Choice Award and Readers' Choice Award for Best Use of HPC in the Cloud.
September/October 2015
Packaging Software PackAssistant and PUZZLE® FachPack 2015!
scapos AG will join the FachPack fair in Nürnberg (29.09 - 1.10.2015) and show their software products for the packaging optimization in hall 4, booth 4-242:
PackAssistant: fast and optimal container load Planning!
Making the best use of container space can save both, transportation and storage costs. One simply needs to find the right way to arrange the objects to be packed in the available container space. Experienced packing planners usually spend a lot of time meticulously arranging and packing parts with complex shapes but, nevertheless, they will not, in most cases, achieve the same packing density as realized with PackAssistant.The PackAssistant software calculates the optimal packing arrangement of identical parts in standard containers by using 3D designs (CAD). This also works for parts with complex shapes, as the software will identify and take the individual shape of the object into account. More!
PUZZLE® - Software for the Palletization!