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August 2017

Primeur Magazine Interview with Guy Lonsdale

 

scapos CEO Guy Lonsdale talks to Primeur Magazine about the company and its HPC-related products and on the general context of EU R&D project activities that promote the broader take-up of HPC and prepare the technology for exascale computing platforms.

The article (“European exascale projects seek to make programme environments more application suitable”) is available here Öffnet externen Link in neuem Fenster http://primeurmagazine.com/weekly/AE-PR-09-17-35.html


May 2017

OptoInspect3D Inline at Control 2017, 9.-12. May, Stuttgart

In collaboration with Fraunhofer IFF scapos will present the new software library Öffnet internen Link im aktuellen FensterOptoInspect3D Inline at the Control 2017 trade-fair in Stuttgart, from May 9th to 12th. You can find us at the Fraunhofer Alliance “Vision” booth (Hall 6, booth 6302). Free day passes are available Öffnet externen Link in neuem Fensterhere.

We are looking forward to meeting you at booth 6/6302.


November 2016

New Product for processing measurement data: OptoInspect3D Inline.

scapos has extended its product portfolio in the area of digital manufacturing and Industry 4.0: the C++ library Öffnet internen Link im aktuellen FensterOptoInspect3D Inline, which is developed by the Fraunhofer Institute IFF in Magdeburg. The software library processes 3D data sets so rapidly, that the inspection of components – for example the comparison with an optimal CAD geometry or the verification of specific geometric characteristics – can be automated and integrated in the manufacturing chain.

Instead of inspecting only some statistical samples, every manufactured part can be examined and validated. The integration of OptoInspect3D Inline into customized process chains is flexible: independent of the digitalization technique used (e.g. structured light 3d scanners, light section or laser scan) the different methods can be combined as needed.

Öffnet internen Link im aktuellen FensterMore information


November 2016

ModelCompare – New Product for fast and easy FE Model Comparison

The new CAE tool Öffnet internen Link im aktuellen FensterModelCompare – developed by Fraunhofer Institute SCAI – provides a fast and easy comparison of different Finite Element models. Currently, the tool is available as an Animator plug-in but can be adapted to other pre- and post-processors. ModelCompare portrays differences regarding discretization, material-ID and thickness, independent of the assigned part ID or the names of the components. It uses specialized mapping techniques that result in extremely short run times.

Fraunhofer SCAI will present the new product, in addition to the latest developments for MpCCI (LINK), at the VDI SIMVEC conference in Baden-Baden on 22nd and 23rd of November, 2016.

Typically, LAMA targets applications with needs in numerical mathematics (such as CFD and FEM simulation). Furthermore, LAMA 2.0 integrates methodology in the areas of optimization (e.g. for seismic imaging), computer vision, and deep learning.
It is available with an industry-friendly dual licensing model (AGPL for open source or individual agreements for other interests).


LAMA 2.0 accelerates more than just numerical applications

Fraunhofer SCAI publishes with Öffnet internen Link im aktuellen FensterLAMA 2.0 the next evolution of its high performance computing framework. It has grown from a linear algebra library to a multi-purpose programming framework.
By offering DSL-like C++-Syntax LAMA encourages writing of hardware-independent code. The framework allows the management of data on heterogeneous and distributed system architectures. These can range from embedded “System on a Chip” (aka SoC) devices to highly-parallel Supercomputers. Consequently, LAMA offers full cluster support. Kernel management is provided with ready-to-use modules encapsulating interfaces to Intel® MKL and Nvidia® cuBLAS/cuSPARSE (targeting all multicore CPUs, Nvidia® GPUs, and Intel® Xeon® Phi™). For the purpose of extending LAMA, the framework supports the integration of custom modules.

Hence, it greatly facilitates the development of fast and scalable software for nearly every system on every scale. LAMA accelerates the time-to-market for new product developments significantly, reduces the time spent in maintaining existing code, and offers up-to-date hardware compatibility for even the latest architectures.

Typically, LAMA targets applications with needs in numerical mathematics (such as CFD and FEM simulation). Furthermore, LAMA 2.0 integrates methodology in the areas of optimization (e.g. for seismic imaging), computer vision, and deep learning.
It is available with an industry-friendly dual licensing model (AGPL for open source or individual agreements for other interests).


Meet us at Eurotox fair in Sevilla!

From 4. - 7. September 2016 scapos will join the Eurotox fair in Sevilla and show its new product in the area of In-Vitro Technologies – the Öffnet externen Link im aktuellen FensterExpoCube!


June 2016

Meet us at ISC 2016!

scapos AG will continue its presence at the ISC series as co-exhibitor at  the ISC 2016 conference and exhibit in Frankfurt (June 19 – June 23, 2016). We will present HPC-related software products and introduce HPC- Cloud R&D funding opportunities, targeting engineering & manufacturing SMEs, arising in the EU H2020 Project Fortissimo 2.
Meet us at booth 818!


November 2015

HPCwire awards for Fortissimo

We were immensely pleased to receive two HPCwire awards at the recent SC'15 event in Austin, Texas. Fortissimo was given both the Editors' Choice Award and Readers' Choice Award for Best Use of HPC in the Cloud.


September/October 2015

Packaging Software PackAssistant and PUZZLE® FachPack 2015!

scapos AG will join the FachPack fair in Nürnberg (29.09 - 1.10.2015) and show their software products for the packaging optimization in hall 4, booth 4-242:

PackAssistant: fast and optimal container load Planning!

Making the best use of container space can save both, transportation and storage costs. One simply needs to find the right way to arrange the objects to be packed in the available container space. Experienced packing planners usually spend a lot of time meticulously arranging and packing parts with complex shapes but, nevertheless, they will not, in most cases, achieve the same packing density as realized with PackAssistant.The PackAssistant software calculates the optimal packing arrangement of identical parts in standard containers by using 3D designs (CAD). This also works for parts with complex shapes, as the software will identify and take the individual shape of the object into account. More!

PUZZLE® - Software for the Palletization!

Contact

scapos AG
Schloss Birlinghoven
53754 Sankt Augustin, Germany

Phone +49 2241 14-2820
Fax +49 2241 14-2817

Öffnet ein Fenster zum Versenden der E-Mail info(at)scapos.com
Öffnet externen Link in neuem Fenster www.scapos.com